訂閱電子報,掌握最新科技與產業趨勢
Next-Level AI Performance for Next-Gen Industrial Applications
The NVIDIA® Jetson AGX Orin™ Industrial module delivers up to 248 TOPs of AI performance for embedded industrial applications with power configurable between 15W and 75W. It’s form-factor and pin-compatible with Jetson AGX Orin, and gives you more than 8X the performance of Jetson AGX Xavier Industrial.
This system-on-module supports multiple concurrent AI application pipelines with an NVIDIA Ampere architecture GPU, next-generation deep learning and vision accelerators, high-speed IO, and fast memory bandwidth. It comes with extended temperature range, operating lifetime, and shock and vibration specifications, as well as support for Error Correction Code (ECC) memory. This makes it ideal for industrialgrade AI products. Plus, the module includes hardware root of trust, secure boot, hardware accelerated cryptography, support for encrypted storage and memory, and other security features to protect your deployments.
The entire Jetson family runs the NVIDIA AI software stack, with available use-casespecific application frameworks, including NVIDIA Isaac™ for robotics, DeepStream for vision AI, and Riva for conversational AI. You can also save significant time with NVIDIA Omniverse™ Replicator for synthetic data generation (SDG), and with NVIDIA TAO toolkit for fine-tuning pretrained AI models from the NGC™ catalog.
Ecosystem partners offer additional AI and system software, developer tools, and custom software development. They can also help with cameras and other sensors, as well as carrier boards and design services for your product.
Jetson Orin modules are unmatched in performance and efficiency for robots and other autonomous machines, and they give you the flexibility to create the next generation of AI solutions with the latest NVIDIA technology. Together with the world-standard NVIDIA AI software stack and an ecosystem of services and products, your road to market has never been faster.
Key Features
Jetson AGX Orin Industrial Module (P3701)
- 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
- 2x NVDLA v2.0
- 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU
- 64GB 256-bit LPDDR5 (+ECC)
- PVA v2.0
Power
- Voltage input: 5V, 7V-20V
- Module Power: 15W-75W
Technical Specification
Jetson AGX Orin Industrial Module | |
---|---|
AI Performance | 248 TOPS (INT8) |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores |
GPU Max Freq | 1.2GHz |
CPU | 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
CPU Max Freq | 2GHz |
DL Accelerator | 2x NVDLA v2.0 |
Vision Accelerator | PVA v2.0 |
Memory | 64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC) |
Storage | 64GB eMMC 5.1 |
PCIe | 2 x8 + 1 x4 + 2 x1 22 lanes PCIe Gen 4 |
CSI Camera | 16 lanes MIPI CSI-2 (16 virtual channels) D-PHY 2.1 40Gbps/ C-PHY 2.0 164Gbps |
Video Encode | 1x 4K60 | 3x 4K30 | 7x 1080p60 | 15x 1080p30 (H.265) H.264, AV1 |
Video Decode | 1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60 | 23x 1080p30 (H.265) H.264, VP9, AV1 |
Display | 1 multi-mode (8K60, 2x 4K60) DP1.4a (+ MST)/HDMI2.1/eDP 1.4 |
Networking | 1 Gbe | 1x 10GBE |
USB | 3x USB 3.2 Gen 2 | 4x USB 2.0 |
Other IOs | 4x UART 3x SPI | 4x I2S | 8x I2C | 2X CAN | PWM | DMIC | DSPK | GPIOs |
Power | 15W-75W |
Mechanical | 100mm x 87mm 699-pin connector |
Industrial Features
Mechanical Shock | 50G Operational |
---|---|
Vibration | 5G Operational |
Temperature | -40°C to 85°C at the TTP Surface |
Temperature Endurance | -40°C to 85°C |
Temperature Humidity Biased | 85°C/85% RH |
Underfill | SoC corner bonding & component underfill |
ECC | DRAM ECC supported |