Subscribe to EDOM TECH Newsletter
xMEMS Labs
XMC-2400 µCooling™ - Fan on a Chip
XMC-2400
The World’s First 1mm-Thin Active Micro Cooling Fan on a Chip
Product Description
The first-ever all-silicon, solid state active micro cooling chip revolutionizing thermal management for ultra-mobile systems and next-generation artificial intelligence (AI) solutions. Thermal management is increasingly challenging, and passive heat spreaders are no longer sufficient on their own. xMEMS active µCooling, featuring an all-silicon, solid state fan at the chip level, can effectively generate airflow and quickly dissipates heat, enabling smartphones and other thin mobile electronics to operate that their maximum performance potential, without throttling. As the world’s first 1mm-thin active micro cooling fan on a chip, XMC-2400 is designed to actively cool even the thinnest handheld form factors.
Application Field
- Smartphones
- Tablets
- External solid-state drives (SSDs)
- Wireless chargers
- XR goggles
- Laptops
Features
- Package dimensions: 9.26W x 7.6L x 1.08H mm
- Top-venting and side-venting packages for flexible integration in different system form-factors
- Bi-directional flow rate, adjustable up to 39cc/sec
- Very robust (qualified to semiconductor quality standards)
- IP58
- Inaudible; all mechanical operation is at ultrasonic frequencies
- SMT-reflowable
- Efficient: estimated 30mW power consumption
*xMEMS Authorized Distributor
